• DocumentCode
    3113203
  • Title

    An investigation on the reduction technique of radiated emission from chassis with PCB

  • Author

    Funato, Hiroki ; Suga, Takashi

  • Author_Institution
    R&D Div., Hitachi America Ltd., Farmington Hills, MI
  • fYear
    2008
  • fDate
    18-22 Aug. 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Correlation between radiated emission from chassis with PCB and the junction current which is the current flowing through screws connecting PCB GND to chassis GND was investigated, and new technique to reduce the junction current was proposed. The measurement results of the junction current frequency spectra showed strong correlation with the emission from chassis with PCB. Also investigation using meshed LCR network SPICE model of PCB and chassis was performed. The calculation results of the junction current showed good correlation with measurement results for frequency spectrum and it suggested that the closer to screw bypass capacitor is placed, the lesser current flows through junction. That new concept was validated by actual measurement and the results of radiated emission showed 19 dB improvements at 320 MHz.
  • Keywords
    SPICE; electromagnetic compatibility; printed circuit design; LCR network; PCB; SPICE model; chassis; frequency 320 MHz; junction current frequency spectra; radiated emission; Capacitors; Circuits; Current measurement; Electromagnetic compatibility; Electromagnetic measurements; Electromagnetic radiation; Fasteners; Frequency measurement; Laboratories; SPICE; PCB layout; chassis; grounding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
  • Conference_Location
    Detroit, MI
  • Print_ISBN
    978-1-4244-1699-8
  • Electronic_ISBN
    978-1-4244-1698-1
  • Type

    conf

  • DOI
    10.1109/ISEMC.2008.4652015
  • Filename
    4652015