Title :
Performance of IW-630 ion implanter for 300-mm wafers
Author :
Nishihashi, T. ; Yokoo, H. ; Hisamune, T. ; Shimizu, T. ; Fukui, R. ; Suzuki, H. ; Kageyama, K. ; Niikura, K. ; Fuwa, K. ; Oka, T. ; Kashimoto, K. ; Fujiyama, J. ; Sakurada, Y.
Author_Institution :
ULVAC Japan Ltd., Kanagawa, Japan
Abstract :
While micro-fineness of semiconductor devices is taking place rapidly, improvements of ion implanters have also been made to achieve flexible use in advanced facilities. IW-630 is a 300-mm ion implanter that provides as small as 17.2 m2 footprint, wide energy range and wide dosage range in order to satisfy the requirements in the advanced facilities. The energy range from 5 to 300 keV is achieved using single-charged ions. In high-energy implantation using multiple-charged ions, energy contamination is free by the final energy filter (collimator magnet) installed after post-acceleration. The implantation dose shift and the degradation of implantation uniformity by out-gassing from photo-resist, which mostly occurs at the time of implanting high-power beams, have been completely solved by ULVAC original cryo-pumping systems. So stable implantation characteristics have been achieved. In wafer handling, unlike the batch system or cassette-load lock system, the load-lock system adopted handles wafers one by one. The practical transfer system and the implant processing capacities realize 200 wafers/hr as the row throughput
Keywords :
beam handling equipment; cryopumping; ion implantation; photoresists; semiconductor doping; 300 mm; 300-mm wafers; 5 to 300 keV; IW-630 ion implanter; cryo-pumping; dose shift; energy contamination; energy filter; footprint; high-energy implantation; implantation uniformity; load-lock system; micro-fineness; multiple-charged ions; out-gassing; photo-resist; post-acceleration; semiconductor devices; single-charged ions; wafer handling; wide dosage range; wide energy range; Acceleration; Contamination; Degradation; Filters; Fluid flow; Implants; Investments; Ion implantation; Resists; Semiconductor devices;
Conference_Titel :
Ion Implantation Technology, 2000. Conference on
Conference_Location :
Alpbach
Print_ISBN :
0-7803-6462-7
DOI :
10.1109/.2000.924170