Title :
High-resolution time-domain site attenuation measurements using conventional EMC test antennas—a numerical study
Author :
Johnk, Robert T.
Author_Institution :
Theor. Div. (ITS.T), Inst. for Telecommun. Sci. (NTIA/ITS), Boulder, CO
Abstract :
This paper explores the possibility of using common types of electromagnetic compatibility (EMC) test antennas to perform high-resolution time-domain site attenuation measurements. The objective of this research is to provide EMC engineers with a tool to perform evaluations of radiated emissions test sites. Numerical simulations are used to site attenuation behavior using biconical antennas, log-periodic dipole arrays, and dipoles. A two-step measurement procedure and data processing sequence are used to generate high-resolution time-domain waveforms. The results are promising, and demonstrate that high-resolution waveforms can be obtained using models of conventional EMC antenna types.
Keywords :
attenuation measurement; conical antennas; dipole antenna arrays; electromagnetic compatibility; fast Fourier transforms; log periodic antennas; method of moments; biconical antenna; conventional EMC test antennas; data processing sequence; electromagnetic compatibility test antenna; fast Fourier transform; frequency domain; ground plane; impulse response; log periodic dipole array; method of moments; radiated emission; s-parameters; time-domain site attenuation measurement; Antenna measurements; Attenuation measurement; Data processing; Dipole antennas; Electromagnetic compatibility; Log periodic antennas; Numerical simulation; Performance evaluation; Testing; Time domain analysis; amplitude spectrum; antenna; biconical; deconvolution; dipole; electromagnetic compatibility (EMC); fast Fourier transform (FFT); frequency domain; ground plane; impulse response; inverse fast Fourier transform (IFFT); log-periodic dipole array (LPDA); method of moments (MoM); numerical model; resolution; s-parameters; time-domain; waveform;
Conference_Titel :
Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
Conference_Location :
Detroit, MI
Print_ISBN :
978-1-4244-1699-8
Electronic_ISBN :
978-1-4244-1698-1
DOI :
10.1109/ISEMC.2008.4652055