Title :
Implantable flexible wireless pressure sensor module
Author :
Shin, Kyu-Ho ; Moon, Chang-Youl ; Lee, Tae-Hee ; Lim, Chang-Hyun ; Kim, Young-Jun
Author_Institution :
Nano Fabrication Center, Samsung Adv. Inst. of Technol., Suwon, South Korea
Abstract :
A chip embedded flexible packaging scheme has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending test and finite element analysis. Thinned silicon chips (t<50 μm) are fabricated by a chemical etching process to avoid possible surface damage. These technologies can be used for an implantable real-time monitoring of blood pressure. Our research targets are developing an implantable blood pressure sensor module and its telemetric measurement. By winding around the coronary arteries, we can measure the blood pressure by capacitance variation of blood vessels.
Keywords :
bending; biomedical telemetry; biosensors; blood pressure measurement; blood vessels; dislocation etching; embedded systems; finite element analysis; packaging; patient monitoring; silicon; bending test; blood pressure; blood vessels; capacitance variation; chemical etching process; chip embedded flexible packaging; finite element analysis; implantable flexible sensor module; real-time monitoring; telemetric measurement; thinned silicon chip; wireless pressure sensor; Biomedical monitoring; Blood pressure; Chemical sensors; Mechanical sensors; Packaging; Pressure measurement; Sensor phenomena and characterization; Silicon; Testing; Wireless sensor networks;
Conference_Titel :
Sensors, 2004. Proceedings of IEEE
Print_ISBN :
0-7803-8692-2
DOI :
10.1109/ICSENS.2004.1426302
