Title :
Thermal considerations on highly integrated module for small power drives
Author :
Frank, W. ; Chung, D. ; Lee, J. ; Song, J.
Author_Institution :
Infineon Technol. Germany, Germany
Abstract :
High integration of power electronic systems require optimised packages. This paper presents an innovative, fully-molded intelligent power module for small power three phase drives in a dual-in-line package. The package itself offers the possibility of integrating additionally the input bridge rectifier. The paper discusses the thermal performance of the module concept by working out the impact of the rectifier loses in respect of case temperatures. The overall losses balance is calculated and the result is compared with measurements while operating the module with and without input rectifier.
Keywords :
electronics packaging; power electronics; rectifiers; dual-in-line package; highly integrated module; input bridge rectifier; power electronic systems; small power drives; thermal considerations; Heat sinks; Insulated gate bipolar transistors; Inverters; Multichip modules; Rectifiers; Semiconductor device measurement; Temperature measurement;
Conference_Titel :
Industrial Electronics (ISIE), 2010 IEEE International Symposium on
Conference_Location :
Bari
Print_ISBN :
978-1-4244-6390-9
DOI :
10.1109/ISIE.2010.5637741