DocumentCode :
3124382
Title :
Thermal considerations on highly integrated module for small power drives
Author :
Frank, W. ; Chung, D. ; Lee, J. ; Song, J.
Author_Institution :
Infineon Technol. Germany, Germany
fYear :
2010
fDate :
4-7 July 2010
Firstpage :
3840
Lastpage :
3844
Abstract :
High integration of power electronic systems require optimised packages. This paper presents an innovative, fully-molded intelligent power module for small power three phase drives in a dual-in-line package. The package itself offers the possibility of integrating additionally the input bridge rectifier. The paper discusses the thermal performance of the module concept by working out the impact of the rectifier loses in respect of case temperatures. The overall losses balance is calculated and the result is compared with measurements while operating the module with and without input rectifier.
Keywords :
electronics packaging; power electronics; rectifiers; dual-in-line package; highly integrated module; input bridge rectifier; power electronic systems; small power drives; thermal considerations; Heat sinks; Insulated gate bipolar transistors; Inverters; Multichip modules; Rectifiers; Semiconductor device measurement; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics (ISIE), 2010 IEEE International Symposium on
Conference_Location :
Bari
Print_ISBN :
978-1-4244-6390-9
Type :
conf
DOI :
10.1109/ISIE.2010.5637741
Filename :
5637741
Link To Document :
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