Title :
Strained silicon: engineered substrates and device integration
Author :
Currie, Matthew T.
Author_Institution :
ArnberWave Syst. Corp., Salem, NH, USA
Abstract :
Strained Si is emerging as a technology vital to the continued progression of transistor performance laid out in the International Technology Roadmap for Semiconductors. Strained Si fundamentals are reviewed, as is the structure of optimized strained Si substrates. Substrate fabrication guidelines that emphasize material quality and economic processing are discussed. The impact of the substrate structure on strained Si device performance and integration is described. Strained-Si-on-Insulator, an advanced structure derived from strained Si substrates, is also introduced.
Keywords :
MOSFET; chemical vapour deposition; dislocation density; elemental semiconductors; semiconductor epitaxial layers; silicon; silicon-on-insulator; substrates; surface roughness; vapour phase epitaxial growth; MOSFET; Si; advanced CMOS devices; chemical vapor deposition; device integration; device performance; economic processing; engineered substrates; epitaxial wafers; fabrication guidelines; material quality; misfit dislocations; optimized substrates; strained silicon; strained-Si-on-insulator; surface roughness; threading dislocations; transistor performance; virtual substrate; Anisotropic magnetoresistance; Capacitive sensors; Electron mobility; Germanium silicon alloys; Lattices; Light scattering; MOSFET circuits; Silicon germanium; Substrates; Tensile strain;
Conference_Titel :
Integrated Circuit Design and Technology, 2004. ICICDT '04. International Conference on
Print_ISBN :
0-7803-8528-4
DOI :
10.1109/ICICDT.2004.1309959