DocumentCode :
3127679
Title :
Bi-CMOS technology for semi-custom integrated circuits
Author :
Alvarez, A.R. ; Schucker, D.W.
Author_Institution :
Cypress Semicond., San Jose, CA, USA
fYear :
1988
fDate :
16-19 May 1988
Abstract :
Technology requirements for (bipolar metal-oxide semiconductor) BiCMOS and semicustom circuit implementations are reviewed. It is proposed that three basic BiCMOS technologies will evolve: high-performance, low cost, and analog-compatible. A first-order estimate of chip and manufacturing costs for BiCMOS suggests a 20-35% increase in die cost. This increase in die costs can only be justified if system performance is improved by 50% or more. A survey of applications indicates that a 50% increase in performance is usually conservative. Significant improvement in I/O speed, ground bounce, clock skew, as well as just internal gate delay is obtained by judicious use of BiCMOS. The availability of high-speed, low-power, high-density ECL SRAMs (emitter-coupled-logic static random-access memories), and upcoming ECL I/O CPUs makes BiCMOS the obvious choice for implementing high-performance ASIC systems
Keywords :
VLSI; integrated circuit technology; integrated logic circuits; technological forecasting; ASIC systems; Bi-CMOS technology; ECL I/O CPUs; ECL SRAMs; I/O speed; VLSI; analog-compatible; applications; bipolar metal-oxide semiconductor; clock skew; cost estimation; die cost; ground bounce; high-performance; internal gate delay; low cost; manufacturing costs; semi-custom integrated circuits; Application specific integrated circuits; Availability; BiCMOS integrated circuits; Clocks; Costs; Delay; Integrated circuit technology; MOS devices; Semiconductor device manufacture; System performance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference, 1988., Proceedings of the IEEE 1988
Conference_Location :
Rochester, NY
Type :
conf
DOI :
10.1109/CICC.1988.20912
Filename :
20912
Link To Document :
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