• DocumentCode
    3128697
  • Title

    Nickel silicide metal gate FDSOI devices with improved gate oxide leakage

  • Author

    Krivokapic, Z. ; Maszara, W. ; Achutan, K. ; King, P. ; Gray, J. ; Sidorow, M. ; Zhao, E. ; Zhang, J. ; Chan, J. ; Marathe, A. ; Lin, M.-R.

  • Author_Institution
    Technol. Res. Group, AMD, Sunnyvale, CA, USA
  • fYear
    2002
  • fDate
    8-11 Dec. 2002
  • Firstpage
    271
  • Lastpage
    274
  • Abstract
    Fully depleted SOI (FDSOI) devices with undoped channel require metal gates to achieve correct threshold voltages. We demonstrate metal gate FDSOI devices using NiSi gates with symmetric V/sub t/ for both NMOS and PMOS devices. Metal gates are stable on 2 nm gate oxide and show capacitance equivalent gate oxide thickness (CET) 0.6 nm thinner than poly gates. The gate leakage current is up to two orders of magnitude lower and high mobility is achieved (peak electron mobility 670 cm/sup 2//Vs and 170 cm/sup 2//Vs for holes).
  • Keywords
    MOSFET; carrier mobility; leakage currents; nickel compounds; semiconductor device metallisation; semiconductor device reliability; silicon-on-insulator; NMOS devices; NiSi; NiSi gates; PMOS devices; Si; fully depleted SOI devices; gate dielectric reliability; gate leakage current; high mobility; metal gate FDSOI devices; symmetric threshold voltage; undoped channel; Atherosclerosis; Electron mobility; Fabrication; Leakage current; MOS devices; Nickel; Silicidation; Silicides; Silicon; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2002. IEDM '02. International
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-7462-2
  • Type

    conf

  • DOI
    10.1109/IEDM.2002.1175830
  • Filename
    1175830