DocumentCode
3128697
Title
Nickel silicide metal gate FDSOI devices with improved gate oxide leakage
Author
Krivokapic, Z. ; Maszara, W. ; Achutan, K. ; King, P. ; Gray, J. ; Sidorow, M. ; Zhao, E. ; Zhang, J. ; Chan, J. ; Marathe, A. ; Lin, M.-R.
Author_Institution
Technol. Res. Group, AMD, Sunnyvale, CA, USA
fYear
2002
fDate
8-11 Dec. 2002
Firstpage
271
Lastpage
274
Abstract
Fully depleted SOI (FDSOI) devices with undoped channel require metal gates to achieve correct threshold voltages. We demonstrate metal gate FDSOI devices using NiSi gates with symmetric V/sub t/ for both NMOS and PMOS devices. Metal gates are stable on 2 nm gate oxide and show capacitance equivalent gate oxide thickness (CET) 0.6 nm thinner than poly gates. The gate leakage current is up to two orders of magnitude lower and high mobility is achieved (peak electron mobility 670 cm/sup 2//Vs and 170 cm/sup 2//Vs for holes).
Keywords
MOSFET; carrier mobility; leakage currents; nickel compounds; semiconductor device metallisation; semiconductor device reliability; silicon-on-insulator; NMOS devices; NiSi; NiSi gates; PMOS devices; Si; fully depleted SOI devices; gate dielectric reliability; gate leakage current; high mobility; metal gate FDSOI devices; symmetric threshold voltage; undoped channel; Atherosclerosis; Electron mobility; Fabrication; Leakage current; MOS devices; Nickel; Silicidation; Silicides; Silicon; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2002. IEDM '02. International
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-7803-7462-2
Type
conf
DOI
10.1109/IEDM.2002.1175830
Filename
1175830
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