The introduction of high heat dissipation material

Along with the increase in circuit density, it becomes more difficult to dissipate heat through the surface of the components. Therefore, the designs and applications for the materials used in heat dissipation as well as high thermal conductivity and low CTE have become the focal point for discussion. In addition, as the high luminance of LEDs is increased and development for brighter LEDs continues, traditional printed circuit boards are finding it more difficult to catch up with the new thermal management need. As such, metal core PCBs are developed to improve the path of heat dissipation, to increase light emitting efficiency, and extend the service life. We develop heat dissipation materials for the thermal management of LEDs and MCPCB. Materials are available in thermal conductivity from 1.0 W/mK to 3.0 W/mK that can meet needs of various applications. As the use of high thermal conductivity materials is close to the traditional PCB manufacturing process, Nanya CCL is well-positioned to offer a total solution for your thermal management needs with our fully vertically integrated supply chain.