Title :
A study to stencil printing technology for solder bump assembly
Author :
Wang, Mu-Chun ; Hsieh, Zhen-Ying ; Huang, Kuo-Shu ; Tu, Chiao-Hao ; Chen, Shuang-Yuan ; Huang, Heng-Sheng
Abstract :
In general, the stencil printing manufacturing in pre-WLCSP (wafer-level chip-scale packaging) is able to be integrated by 7-step processes, including two masks and one set of stencil plate. After the formation of solder ball, the specified professional probe card is needed to verify whether the electric functions of this packaged IC are good. After this step, the wafer grinding, the wafer cutting, the chip choice and the final test (F/T) are gradually adopted to proceed. Finally, due to the customer´s need, the shipping package type to customers is, generally, tray or tape and reel. Although the stencil printing technology can provide the mass-production capability, the mainly existing problems of this technology are the quality of manufacturing steel plate, the coating operation for solder paste, and the flatness of wafer surface. These issues usually constrain the minimization of the size of the solder ball and the pitch. Thinking to solve these issues, this package technology is still feasible in assembly competition.
Keywords :
chip scale packaging; microassembling; printing; soldering; wafer level packaging; packaged IC; pre-WLCSP; pre-wafer-level chip-scale packaging; probe card; solder ball; solder bump assembly; stencil printing technology; wafer cutting; wafer grinding; Assembly; Chip scale packaging; Coatings; Integrated circuit packaging; Manufacturing processes; Printing; Probes; Steel; Testing; Wafer scale integration;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
DOI :
10.1109/IMPACT.2009.5382134