DocumentCode
3129683
Title
Self-assembled out-of-plane high-Q integrated inductors
Author
Van Schuylenbergh, K. ; Chua, C.L. ; Fork, D.K. ; Jeng-Ping Lu ; Griffiths, B.
Author_Institution
Palo Alto Res. Center, CA, USA
fYear
2002
fDate
8-11 Dec. 2002
Firstpage
479
Lastpage
482
Abstract
Self-assembled high-quality (Q) factor, 3-D inductors were batch-fabricated. The out-of-plane geometry reduces eddy current and skin effect losses. Coils achieve Q-factors over 70 on both glass and 15-20 /spl Omega/-cm Si at 1 GHz. 3-D coil LC oscillators had 12.3 dB lower phase-noise versus spiral coils. Encapsulation affected neither phase noise nor Q-factor.
Keywords
CMOS integrated circuits; Q-factor; eddy current losses; encapsulation; inductors; phase noise; radiofrequency integrated circuits; skin effect; 15 to 20 ohmcm; 3D inductors; CMOS; LC oscillators; Q-factors; RF front ends; coils; eddy current losses; encapsulation; out-of-plane high-Q integrated inductors; phase noise; skin effect losses; Coils; Eddy currents; Encapsulation; Geometry; Glass; Inductors; Oscillators; Q factor; Skin effect; Spirals;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2002. IEDM '02. International
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-7803-7462-2
Type
conf
DOI
10.1109/IEDM.2002.1175883
Filename
1175883
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