DocumentCode
3129754
Title
New procedure for re-machining in high speed machining processes based on a DSP architecture
Author
Swingedouw, F. ; Bourny, V. ; Capitaine, T. ; Senlis, J. ; Lorthois, A. ; Santos, B. Dos
Author_Institution
Dept. of Embedded Syst., Lab. des Technol. Innovantes (LTI), St. Quentin, France
fYear
2012
fDate
5-8 Aug. 2012
Firstpage
1557
Lastpage
1562
Abstract
This paper presents a new method implemented in an embedded system to detect the first contact between the rotating tool and the surface of the workpiece in the high speed machining operations with a high degree of accuracy. This method is based on the measurement of impedance variations and the calculation of a correlation function. This embedded system associated with the machining process ensures not only the geometrical quality of machined surfaces but also to avoid measuring the tool with tool touch probe, which allows to compensate the tool wear. The purpose of this project is to hold together the world of embedded and the machine world and make an industrial demonstrator integrating different features developed.
Keywords
digital signal processing chips; embedded systems; machining; mechanical contact; production engineering computing; quality control; DSP architecture; contact; embedded systems; geometrical quality; high speed machining; impedance measurement; remachining; surface machining; tool wear; Accuracy; Computer numerical control; Embedded systems; Frequency measurement; Impedance; Machining; Probes; embedded system (ES); impedances variations; industrial demonstrator; machining process;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronics and Automation (ICMA), 2012 International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4673-1275-2
Type
conf
DOI
10.1109/ICMA.2012.6284368
Filename
6284368
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