DocumentCode
3130198
Title
Microassembly Techniques for a Three-Dimensional Neural Stimulating Microelectrode Array
Author
Yao, Y. ; Gulari, M.N. ; Wise, K.D.
Author_Institution
Eng. Res. Center for Wireless Integrated Microsyst., Michigan Univ., Ann Arbor, MI
fYear
2006
fDate
Aug. 30 2006-Sept. 3 2006
Firstpage
4643
Lastpage
4646
Abstract
This paper describes microassembly techniques for an out-of-plane three-dimensional microelectrode array for neural stimulating and recording in the central nervous system. An interlocking mechanism has been introduced into the microassembly components to facilitate the process, increase the robustness of the assembled device and improve the yield of the overall system. In-vivo testing has demonstrated full functionality of the microassembled 3D array
Keywords
bioMEMS; biomedical electrodes; microassembling; microelectrodes; neurophysiology; MEMS; central nervous system; in-vivo testing; interlocking mechanism; microassembled 3D array; microassembly techniques; neural recording; neural stimulating microelectrode array; three-dimensional microelectrode array; Assembly systems; Bonding; Circuits; Gold; Microassembly; Microelectrodes; Micromechanical devices; Probes; Robustness; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location
New York, NY
ISSN
1557-170X
Print_ISBN
1-4244-0032-5
Electronic_ISBN
1557-170X
Type
conf
DOI
10.1109/IEMBS.2006.260836
Filename
4462837
Link To Document