DocumentCode
3131297
Title
Session 16: Novel thermal materials
fYear
2009
fDate
21-23 Oct. 2009
Firstpage
452
Lastpage
452
Abstract
Start of the above-titled section of the conference proceedings record.
Keywords
Chemical engineering; Chemical industry; Chemical technology; Composite materials; Materials science and technology; Organic materials; Semiconductor materials; Thermal conductivity; Thermal engineering; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location
Taipei
Print_ISBN
978-1-4244-4341-3
Type
conf
DOI
10.1109/IMPACT.2009.5382214
Filename
5382214
Link To Document