DocumentCode :
3131581
Title :
Session 19: Design, modeling & testing III
fYear :
2009
fDate :
21-23 Oct. 2009
Firstpage :
509
Lastpage :
509
Abstract :
Start of the above-titled section of the conference proceedings record.
Keywords :
Chip scale packaging; Contacts; Finite element methods; Mechanical engineering; Metallization; Probes; Semiconductor device modeling; Silicon; Substrates; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Type :
conf
DOI :
10.1109/IMPACT.2009.5382230
Filename :
5382230
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3131581
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