Title :
K-band near-hermetic surface mount package using liquid crystal polymer for high power applications
Author :
Chen, Cheng ; Pham, Anh-Vu
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of California Davis, Davis, CA, USA
Abstract :
We present the design and development of a K-band surface mount package for ~10 Watt DC power dissipation devices. The package forms a near hermetic cavity enclosed by liquid crystal polymer (LCP) and copper. The measured junction temperature of ~10 Watt DC power dissipation is 143.9°C with the base plate at 80°C. The package feedthrough achieves a measured insertion loss of ~0.5 dB to 0.8 dB at K-band frequencies.
Keywords :
copper; liquid crystal polymers; millimetre wave devices; semiconductor device packaging; surface mount technology; DC power dissipation devices; K-band frequency; K-band near-hermetic surface mount package; K-band surface mount package; LCP; copper; hermetic cavity; insertion loss; junction temperature; liquid crystal polymer; package feedthrough; temperature 143.9 C; temperature 80 C; Copper; Frequency measurement; Insertion loss; K-band; Liquid crystal polymers; Loss measurement; Packaging; Power dissipation; Power measurement; Temperature measurement; Millimeter wave devices; Moisture; Plastic packaging; Semiconductor device packaging; Surface mounting;
Conference_Titel :
Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4244-6056-4
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2010.5516971
