DocumentCode
31320
Title
Fast and Accurate Characterization of MOS and Interconnect Capacitance Using Direct Charge Measurement (DCM)
Author
Goto, Misako ; Miyake, Yousuke ; Taniguchi, Jun ; Takano, Kyoya
Author_Institution
Agilent Technol. Int. Japan, Ltd., Hachioji, Japan
Volume
26
Issue
3
fYear
2013
fDate
Aug. 2013
Firstpage
262
Lastpage
272
Abstract
A fast and accurate capacitance measurement technique, direct charge measurement (DCM), is introduced to improve productivity of semiconductor parametric testing. The approach is simpler and much faster compared with conventional method using charge-based capacitance measurement (CBCM) or LCR meter. On-chip active device is not an essential necessity for DCM test structure and it is easy to implement parallel measurements. The basic theory, parallel measurement method and mathematical analysis on non-linear MOS capacitance measurement are explained. For interconnect capacitance measurement, an extension of DCM, degenerated exhaustive direct charge measurement (DEDCM) is presented as a faster, more accurate and thorough characterization technique. Experimental results show good data matching and significant throughput improvement over conventional LCR meter measurements.
Keywords
MOSFET; capacitance measurement; charge measurement; semiconductor device testing; CBCM; DEDCM; LCR meter; charge-based capacitance measurement; data matching; degenerated exhaustive direct charge measurement; interconnect capacitance; nonlinear MOS capacitance measurement; semiconductor parametric testing; Capacitance measurement; Charge-based capacitance measurement (CBCM); LCR meter; MOS devices; capacitance-voltage characteristics; direct charge measurement (DCM); integrated circuit interconnections;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2013.2259268
Filename
6506963
Link To Document