DocumentCode
3132232
Title
Horizontal systems: Leading technology for next generation HDI production
Author
Kenny, Stephen ; Magaya, Tafadzwa
Author_Institution
Atotech GmbH, Berlin, Germany
fYear
2009
fDate
21-23 Oct. 2009
Firstpage
633
Lastpage
636
Abstract
The developments in high density interconnect, HDI technology are characterized by the following: - Ever higher packaging density. - Reduction in line and space. - New dielectrics to meet high frequency demands. - Employment of thinner substrates. - Environmental and legislative impact. - Requirement for high overall process yields. - Demand for continuous reduction in process costs.
Keywords
integrated circuit interconnections; integrated circuit packaging; environmental impact; high density interconnect; higher packaging density; horizontal systems; legislative impact; line reduction; process costs; space reduction; thinner substrates; Copper; Costs; Dielectric substrates; Drilling; Fiber lasers; Optical materials; Paper technology; Production systems; Space technology; Windows;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location
Taipei
Print_ISBN
978-1-4244-4341-3
Electronic_ISBN
978-1-4244-4342-0
Type
conf
DOI
10.1109/IMPACT.2009.5382265
Filename
5382265
Link To Document