• DocumentCode
    3132261
  • Title

    Semiconductor component qualification

  • Author

    Wu, Mei-Ling ; Pecht, Michael

  • Author_Institution
    Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    644
  • Lastpage
    647
  • Abstract
    Semiconductor component manufacturers supply to different products in a wide range of market segments, and therefore the end use conditions may not always be known. Qualifying a semiconductor component or demonstrating that it can operate reliably under use conditions can therefore be a challenging task. The goal of this paper is to describe the challenges in semiconductor component qualification and demonstrate how use conditions and product configuration can influence reliability and therefore qualification test selection. Industry practices on component qualification are summarized and an ideal component qualification plan that takes into account end use conditions and product configuration is described.
  • Keywords
    semiconductor device manufacture; product configuration; qualification test selection; semiconductor component qualification; use conditions; Qualifications;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382267
  • Filename
    5382267