DocumentCode
3132261
Title
Semiconductor component qualification
Author
Wu, Mei-Ling ; Pecht, Michael
Author_Institution
Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fYear
2009
fDate
21-23 Oct. 2009
Firstpage
644
Lastpage
647
Abstract
Semiconductor component manufacturers supply to different products in a wide range of market segments, and therefore the end use conditions may not always be known. Qualifying a semiconductor component or demonstrating that it can operate reliably under use conditions can therefore be a challenging task. The goal of this paper is to describe the challenges in semiconductor component qualification and demonstrate how use conditions and product configuration can influence reliability and therefore qualification test selection. Industry practices on component qualification are summarized and an ideal component qualification plan that takes into account end use conditions and product configuration is described.
Keywords
semiconductor device manufacture; product configuration; qualification test selection; semiconductor component qualification; use conditions; Qualifications;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location
Taipei
Print_ISBN
978-1-4244-4341-3
Electronic_ISBN
978-1-4244-4342-0
Type
conf
DOI
10.1109/IMPACT.2009.5382267
Filename
5382267
Link To Document