• DocumentCode
    3132262
  • Title

    Cost effective inspection methodology of AIT-II with ADC 2.0

  • Author

    Terryll, Kathleen ; Mateos, Carlos ; Lutz, Andreas

  • Author_Institution
    Agere Syst., Madrid, Spain
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    179
  • Lastpage
    185
  • Abstract
    The AIT-II, a dark-field tool with automatic defect classification (ADC), is one of the most powerful in-line inspection combinations for reducing defect excursions and working on baseline yield issues. This report highlights the yield enhancement and cost benefits of AIT-II with Impact ADC 2.0 at Agere Systems, Madrid, Spain. The current, streamlined, inspection methodology is presented and contrasted with the traditional method. Defects found by the ADC classifiers are presented with real examples of the baseline events, both yield limiting and nonyield limiting. More importantly, we demonstrate how these tools can help people focus on the real yield limiting issues. Finally, we propose how to calculate cost of ownership by taking into account the yield “saved” by using AIT-II with Impact ADC 2.0
  • Keywords
    cost-benefit analysis; fault location; inspection; integrated circuit testing; integrated circuit yield; pattern classification; production testing; ADC classifiers; AIT-II; AIT-II dark-field tool; Impact ADC 2.0; automatic defect classification; baseline yield; cost benefits; cost effective inspection methodology; cost of ownership; defect excursions; in-line inspection; inspection methodology; nonyield limiting events; saved yield costs; yield enhancement; yield limiting events; yield limiting issues; Accuracy; Application specific integrated circuits; Costs; Data analysis; Data engineering; Dielectrics; Inspection; Production systems; Sampling methods; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference, 2001 IEEE/SEMI
  • Conference_Location
    Munich
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-6555-0
  • Type

    conf

  • DOI
    10.1109/ASMC.2001.925644
  • Filename
    925644