Title :
Statistical bin analysis on wafer probe
Author :
Muriel, Sebastian ; Garcia, Paco ; Maire-Richard, Oscar ; Monleón, Marta ; Recio, Miguel
Author_Institution :
Agere Syst., Madrid, Spain
Abstract :
In the semiconductor environment, statistical process control (SPC) has been extensively used to assure the quality of each fabrication step. The purpose of this paper is to show why and how the final step in integrated circuit (IC) manufacturing, the results from testing of all chips on each wafer, should be subject to statistical control as a standard operating procedure
Keywords :
integrated circuit testing; integrated circuit yield; probes; production testing; quality control; statistical analysis; statistical process control; IC manufacturing; SPC; chip testing; fabrication step; integrated circuit manufacturing; quality; semiconductor environment; standard operating procedure; statistical bin analysis; statistical control; statistical process control; wafer probe; wafer testing; Circuit testing; Condition monitoring; Control charts; Fabrication; Gaussian distribution; Integrated circuit manufacture; Probes; Process control; Pulp manufacturing; Semiconductor device manufacture;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2001 IEEE/SEMI
Conference_Location :
Munich
Print_ISBN :
0-7803-6555-0
DOI :
10.1109/ASMC.2001.925645
