Efficiency analysis of electroplating gold bump in assembly

In flat panel displays, the assembly format of driving ICs, due to the rectangular chip shape, is usually with a difference of conventional commercial ICs constructed with a square configuration. Because of this concern, the electroplating gold bump technology in package was desirably developed. Additionally, in the characteristics of hardness, melting point, and stability, gold material is generally better than tin material. Although tin in cost is lower than gold, the previous just can be applied to the soldering joint, but not to the thermal compression process. Therefore, in this study, the electroplating gold bump in assembly was probed in detail to analyze the possibility of mass-production.