Performance analysis in modeling micro capacitive pressure sensor

In this paper, a finite element numerical (FEM) simulation via COMSOL Multiphysics was carried out to study the performance of micro capacitive pressure sensor. At first stage, the effect of fabrication was considered. At second stage, calculating the relationship between capacitance and applied pressure under different operation condition, including bonding temperature, thermal expansion coefficient of silicon and thickness of pressurized compartment by using Taguchi Method. Finally, finding the best condition of fabrication and operation. The simulation showed that capacitance of the sensor was as the function of the operating pressure. The higher bonding temperature was fabricated, the lower capacitance can be achieved under the same applied load. And thinner thickness of the pressurized compartment provided good resolution. Thus, the performance of micro capacitive pressure sensor can be predicted with qualitative analysis and with quantitative analysis via numerical simulation.