• DocumentCode
    3133130
  • Title

    Session 3: HDI, embedded & advanced technology

  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    76
  • Lastpage
    76
  • Abstract
    Start of the above-titled section of the conference proceedings record.
  • Keywords
    Companies; Copper; Data mining; Magnetic circuits; Materials; Mobile communication; Sun;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382316
  • Filename
    5382316
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3133130