Title :
Integration of passive components in thin film multilayer MCM-D technology for wireless front-end applications
Author :
Pieters, P. ; Vaesen, K. ; Carchon, G. ; Brebels, S. ; De Raedt, W. ; Beyne, E.
Author_Institution :
MCP/HDIP Group, IMEC, Leuven, Belgium
Abstract :
In the current trend towards portable applications, the integration of passive components has become very important. This paper introduces high quality integrated passive components in thin film multilayer MCM-D technology. The main characteristics and modeling issues for use at RF and microwave frequencies are discussed. Also, a number of circuits applicable in wireless front-ends using the integrated passives are presented. These show that MCM-D may be used for the integration of miniature systems for wireless applications
Keywords :
UHF integrated circuits; microwave integrated circuits; multichip modules; radio equipment; thin film circuits; RF frequencies; high quality integrated passive components; microwave frequencies; miniature systems; modeling; passive components integration; thin film multilayer MCM-D technology; wireless front-end applications; Coplanar waveguides; Copper; Dielectric losses; Dielectric substrates; Dielectric thin films; Integrated circuit interconnections; Integrated circuit technology; Nonhomogeneous media; Thin film circuits; Transistors;
Conference_Titel :
Microwave Conference, 2000 Asia-Pacific
Conference_Location :
Sydney, NSW
Print_ISBN :
0-7803-6435-X
DOI :
10.1109/APMC.2000.925767
