Title :
A TSV-based architecture for AC-DC converters
Author_Institution :
Mentor Graphics, Cairo, Egypt
Abstract :
In this paper, a proposed through silicon via (TSV) structure is used to construct AC-DC converters. This structure is analyzed using 3D electromagnetic full-wave simulators. The results show that the proposed 3D converter exhibits small area with superior performance compared to a 2D transformer, for the same footprint as lossy substrate effects are neglected for low frequency range of interest for DC converters.
Keywords :
AC-DC power convertors; elemental semiconductors; silicon; three-dimensional integrated circuits; 2D transformer; 3D electromagnetic full-wave simulators; AC-DC converters; TSV-based architecture; lossy substrate effects; through silicon via structure; AC-DC power converters; Integrated circuit modeling; Metals; Silicon; Solid modeling; Three-dimensional displays; Through-silicon vias; AC-DC converter; DC-DC Converter; TSV; Three-Dimensional ICs; Through Silicon Via; Transformer;
Conference_Titel :
Design and Test Symposium (IDT), 2013 8th International
Conference_Location :
Marrakesh
DOI :
10.1109/IDT.2013.6727096
