• DocumentCode
    3133360
  • Title

    The ITC test compression shootout

  • Author

    Davidson, Scott

  • Author_Institution
    Sun Microsystems, Inc., Sunnyvale, CA
  • fYear
    2005
  • fDate
    8-8 Nov. 2005
  • Lastpage
    1283
  • Abstract
    As IC feature sizes shrink, density increases, and the number of gates and thus faults explode, we have managed to keep up by developing new fault models and new test generation approaches to detect these faults. Test data size grows with the size of the longest scan chain. Over the last few years many have proposed a solution in the form of test compression. The purpose of this panel is to compare compression methods
  • Keywords
    built-in self test; integrated circuit testing; IC; ITC test compression; fault models; longest scan chain; test data; Automatic testing; Built-in self-test; Circuit faults; Circuit testing; Costs; Electrical fault detection; Fault detection; Integrated circuit modeling; Integrated circuit testing; Sun;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2005. Proceedings. ITC 2005. IEEE International
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-9038-5
  • Type

    conf

  • DOI
    10.1109/TEST.2005.1584110
  • Filename
    1584110