• DocumentCode
    3133377
  • Title

    Chemical mechanical polishing: the impact of a new technology on an industry

  • Author

    Perry, K.A.

  • Author_Institution
    Obsidian Inc., Fremont, CA, USA
  • fYear
    1998
  • fDate
    9-11 June 1998
  • Firstpage
    2
  • Lastpage
    5
  • Abstract
    Chemical Mechanical Polishing (CMP), a technology born in IBM Confidential culture, has remained true to its heritage not only because of its significant competitive advantage, but because of the history of its birth in the semiconductor industry. In spite of this heritage, CMP has grown from its invention in 1984, to one of the fastest growing segments of the semiconductor equipment industry. In 1997 the growth rate of CMP equipment averaged 30% in comparison with the rest of the semiconductor equipment market. The factors that enabled this dynamic growth include both the technical advantages of CMP and the history of its development and subsequent spread into the industry. The growth of CMP technology has spawned new business and supplier networks as well as new fields of study. As the science of CMP evolves, it continues to borrow from several diverse technical fields and has created a new science within semiconductors.
  • Keywords
    chemical mechanical polishing; semiconductor technology; CMP technology; chemical mechanical polishing; semiconductor equipment industry; Chemical industry; Chemical technology; Electronics industry; Glass; History; Logic devices; Metallization; Planarization; Semiconductor devices; Surface cleaning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 1998. Digest of Technical Papers. 1998 Symposium on
  • Conference_Location
    Honolulu, HI, USA
  • Print_ISBN
    0-7803-4770-6
  • Type

    conf

  • DOI
    10.1109/VLSIT.1998.689177
  • Filename
    689177