DocumentCode
3133377
Title
Chemical mechanical polishing: the impact of a new technology on an industry
Author
Perry, K.A.
Author_Institution
Obsidian Inc., Fremont, CA, USA
fYear
1998
fDate
9-11 June 1998
Firstpage
2
Lastpage
5
Abstract
Chemical Mechanical Polishing (CMP), a technology born in IBM Confidential culture, has remained true to its heritage not only because of its significant competitive advantage, but because of the history of its birth in the semiconductor industry. In spite of this heritage, CMP has grown from its invention in 1984, to one of the fastest growing segments of the semiconductor equipment industry. In 1997 the growth rate of CMP equipment averaged 30% in comparison with the rest of the semiconductor equipment market. The factors that enabled this dynamic growth include both the technical advantages of CMP and the history of its development and subsequent spread into the industry. The growth of CMP technology has spawned new business and supplier networks as well as new fields of study. As the science of CMP evolves, it continues to borrow from several diverse technical fields and has created a new science within semiconductors.
Keywords
chemical mechanical polishing; semiconductor technology; CMP technology; chemical mechanical polishing; semiconductor equipment industry; Chemical industry; Chemical technology; Electronics industry; Glass; History; Logic devices; Metallization; Planarization; Semiconductor devices; Surface cleaning;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 1998. Digest of Technical Papers. 1998 Symposium on
Conference_Location
Honolulu, HI, USA
Print_ISBN
0-7803-4770-6
Type
conf
DOI
10.1109/VLSIT.1998.689177
Filename
689177
Link To Document