Title :
Detection of underfill epoxy defects in flip chip packages with the aid of SAM, parallel polishing and FIB
Author :
Tang, T.N. ; Heng, H.C. ; Chan, S.Y. ; Hiew, Marshall
Author_Institution :
Dept. of Quality Eng., Adv. Micro Devices, Penang, Malaysia
Abstract :
This paper describes the techniques of scanning acoustic microscopy (SAM), parallel polishing and focused ion beam (FIB) cross-sectioning used to detect and identify underfill defects in C4 flip chip packages
Keywords :
acoustic microscopy; encapsulation; flip-chip devices; focused ion beam technology; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; polishing; C4 flip chip packages; FIB; FIB cross-sectioning; SAM; flip chip packages; focused ion beam cross-sectioning; parallel polishing; scanning acoustic microscopy; underfill defects; underfill epoxy defect detection; underfill epoxy defects; Acoustic devices; Acoustic signal detection; Acoustical engineering; Flip chip; Integrated circuit packaging; Integrated circuit technology; Ion beams; Laboratories; Microscopy; Silicon;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 1999. Proceedings of the 1999 7th International Symposium on the
Print_ISBN :
0-7803-5187-8
DOI :
10.1109/IPFA.1999.791303
