DocumentCode
3136687
Title
Mechanical characteristics of hipped SiC particulate-reinforced aluminum alloy metal matrix composites
Author
Chung, C.Y. ; Lau, K.C.
Author_Institution
Dept. of Phys. & Mater. Sci., City Univ. of Hong Kong, Hong Kong
Volume
2
fYear
1999
fDate
1999
Firstpage
1023
Abstract
Al-Cu alloy matrix composites reinforced with various volume fraction of SiC particulates (SiCp) were prepared by conventional powder metallurgy (PM) and hot isostatic pressing (HIP) processes. The tensile and fracture behavior of PM and HIPPed composites were studied. The experimental results were compared with the shear-lag, Eshelby and modified Eshelby micro-mechanics models. The composite stiffness tends to increase with increasing SiCp volume fraction. The modified Eshelby model correlated well with the experimental results whereas the stiffness prediction of shear-lag model was lower than the experimental data. The fracture stresses of PM and HIPPed metal matrix composites decrease with increasing SiCp volume fraction. This was attribute to the cracking of SiCp upon tensile deformation
Keywords
aluminium alloys; copper alloys; crack-edge stress field analysis; elastic constants; fracture; hot pressing; particle reinforced composites; powder metallurgy; silicon compounds; SiC particle reinforced Al-Cu alloy matrix composites; SiC particle volume fraction; SiC-Al-Cu; composite stiffness; cracking; fracture behavior; fracture stresses; hipped SiC particulate-reinforced Al alloy metal matrix composites; hot isostatic pressing processes; mechanical characteristics; modified Eshelby micro-mechanics models; powder metallurgy; shear-lag models; stiffness prediction; tensile deformation; Aerospace materials; Aluminum alloys; Hip; Mechanical factors; Microstructure; Powders; Predictive models; Pressing; Silicon carbide; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Intelligent Processing and Manufacturing of Materials, 1999. IPMM '99. Proceedings of the Second International Conference on
Conference_Location
Honolulu, HI
Print_ISBN
0-7803-5489-3
Type
conf
DOI
10.1109/IPMM.1999.791521
Filename
791521
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