3D system-in-package integration of 60 GHz aperture-coupled micromachined microstrip antennas

Author

Brebels, Steven ; Mohammadpour-Aghdam, Karim ; De Raedt, Walter ; Vandenbosch, Guy

fYear

2010

fDate

23-28 May 2010

Firstpage

1028

Lastpage

1031

Abstract

In this paper, an integrated aperture-coupled microstrip antenna for 60 GHz is introduced with the patch element on the inside of the micromachined air cavity. The patch is therefore protected from the outside environment. The coupling of patch and cavity resonance leads further to a compact yet wideband antenna solution. This antenna is a good candidate for realizing active integrated antenna modules in high-resistivity Silicon.

Keywords

electronics packaging; microstrip antennas; resonance; 3d system-in-package integration; aperture-coupled micromachined microstrip antennas; cavity resonance; circuit packaging; frequency 60 GHz; integrated antenna modules; integrated aperture-coupled microstrip antenna; micromachined air cavity; millimeter wave antennas; patch antenna; Antenna accessories; Aperture antennas; Aperture coupled antennas; Broadband antennas; Microstrip antennas; Millimeter wave communication; Millimeter wave devices; Millimeter wave technology; Silicon; Substrates; Millimeter wave antennas; active antennas; antenna measurements; thin film circuit packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International

Conference_Location

Anaheim, CA

ISSN

0149-645X

Print_ISBN

978-1-4244-6056-4

Electronic_ISBN

0149-645X

Type

conf

DOI

10.1109/MWSYM.2010.5517387

Filename

5517387