Two dimensional micro conveyance system with through holes for electrical and fluidic interconnection

Author

Mita, Yoshio ; Konishi, Satoshi ; Fujita, Hiroyuki

Author_Institution

Inst. of Ind. Sci., Tokyo Univ., Japan

Volume

1

fYear

1997

fDate

16-19 Jun 1997

Firstpage

37

Abstract

A fluidic micro actuator array with through-the-wafer interconnection is fabricated. Actuators are composed of micro cantilevers over through holes. Cantilevers pass/cut the air flow which is applied from the backside via the through hole nozzles. Each through hole is also used for electrical interconnection by evaporating Au metal on it. The actuator array is assembled with an IC controller to construct an autonomous distributed conveyance system

Keywords

arrays; conveyors; fluidic devices; integrated circuit interconnections; microactuators; nozzles; Au; Au metal evaporation; IC controller; actuator array; air flow; autonomous distributed conveyance system; electrical interconnection; fluidic interconnection; micro cantilevers; through hole nozzles; through holes; two dimensional micro conveyance system; Actuators; Anisotropic magnetoresistance; Chromium; Control systems; Fluidic microsystems; Gold; Integrated circuit interconnections; Microactuators; Microfluidics; Sputter etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on

Conference_Location

Chicago, IL

Print_ISBN

0-7803-3829-4

Type

conf

DOI

10.1109/SENSOR.1997.613575

Filename

613575