Title :
Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon
Author :
Heschel, Matthias ; Bouwstra, Siebe
Author_Institution :
Mikroelektronik Centret, Tech. Univ. Denmark, Lyngby, Denmark
Abstract :
The authors describe a photoresist treatment yielding conformal coating of three-dimensional silicon structures. This even includes the sharp corners of through-holes obtained by anisotropic etching in (100)-silicon. Resist reflow from these corners is avoided by replacing the common baking procedure with a proper vacuum treatment. The investigated photoresist is Shipley´s Eagle 2100 ED, a negative-working electrodeposited photoresist. Electrical frontside to backside interconnections have been made using this photoresist as an etch mask
Keywords :
conformal coatings; electrodeposition; elemental semiconductors; etching; integrated circuit interconnections; photoresists; silicon; vacuum techniques; 1 to 2 hour; 1E-4 Pa; 3D lithography; Shipley Eagle 2100 ED; Si; anisotropically etched through-holes; conformal coating; electrical frontside to backside interconnections; etch mask; negative-working electrodeposited photoresist; photoresist treatment; resist reflow; sharp corners; three-dimensional Si structures; vacuum treatment; Adhesives; Anisotropic magnetoresistance; Coatings; Etching; Lithography; Metallization; Microelectronics; Resists; Silicon; Stacking;
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
DOI :
10.1109/SENSOR.1997.613620
