Wire bonding over insulating substrates by electropolymerization of polypyrrole using scanning micro-needle

Electrically conducting wire of 10-200 μm width was formed freely over the electrically insulating substrate by “electropolymerization of conducting polymer using Scanning Microneedle”. The conductivity of the wire was estimated to be about 0.5-200 s/cm from the I-V characteristics and the value was not inferior to the reported conductivity of the electrochemically polymerized polypyrrole film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes