• DocumentCode
    314134
  • Title

    Integrated sensor wafer-level packaging

  • Author

    Audet, Sarah A. ; Edenfeld, Katrina M.

  • Author_Institution
    Adv. Interconnect Syst. Lab., Motorola Inc., Tempe, AZ, USA
  • Volume
    1
  • fYear
    1997
  • fDate
    16-19 Jun 1997
  • Firstpage
    287
  • Abstract
    Low cost packaging for integrated sensor devices is key to the ingress of silicon sensors into the consumer and industrial marketplace. Wafer-level packaging for integrated sensors can be performed using several technologies. The benefits and challenges of several these technologies are described
  • Keywords
    CMOS integrated circuits; elemental semiconductors; glass; microsensors; silicon; wafer bonding; 10 to 25 mum; CMOS; CVD; MEMS; Si; Si sensors; consumer electronics; frit glass; industrial electronics; integrated sensor wafer-level packaging; low cost packaging; CMOS process; Contamination; Glass; Inorganic materials; Lead; Packaging; Silicon; Temperature sensors; Wafer bonding; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    0-7803-3829-4
  • Type

    conf

  • DOI
    10.1109/SENSOR.1997.613640
  • Filename
    613640
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=314134