Micro tensile-test of silicon film having different crystallographic orientations

Author

Sato, Kazuo ; Shikida, Mitsuhiro ; Yoshioka, Tetsuo ; Ando, Taeko ; Kawabata, Tatsuo

Author_Institution

Dept. of Micro Syst. Eng., Nagoya Univ., Japan

Volume

1

fYear

1997

fDate

16-19 Jun 1997

Firstpage

595

Abstract

Uniaxial tensile testing of a single-crystal silicon film was carried out on a silicon chip. A tensile testing system was integrated on a silicon chip. A process for fabricating a test chip containing a specimen whose tensile axis has an arbitrary orientation was developed. The mechanical properties, such as elastic modulus and fracture strain, of silicon films having different orientations of ⟨100⟩, ⟨110⟩, and ⟨111⟩, are tested and compared

Keywords

crystal orientation; elastic moduli measurement; elemental semiconductors; fatigue testing; fracture toughness testing; micromechanical devices; semiconductor device testing; semiconductor thin films; silicon; tensile testing; MEMS devices; Si; crystallographic orientations; elastic modulus; fracture strain; mechanical properties; micro tensile-test; orientation; silicon chip; single-crystal silicon film; tensile axis; test chip; uniaxial tensile testing; Bars; Crystallography; Force measurement; Materials testing; Mechanical factors; Semiconductor device measurement; Semiconductor films; Silicon; Springs; System testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on

Conference_Location

Chicago, IL

Print_ISBN

0-7803-3829-4

Type

conf

DOI

10.1109/SENSOR.1997.613721

Filename

613721