Mechanical behavior of structures for microelectromechanical systems

Author

Suwito, Wan ; Dunn, Martin L. ; Cunningham, Shawn J.

Author_Institution

Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA

Volume

1

fYear

1997

fDate

16-19 Jun 1997

Firstpage

611

Abstract

Our recent efforts to characterize the mechanical behavior of micromachined single crystal silicon structures are presented. These include the design and fabrication of free-standing thin film test structures, micromechanical tensile testing, and a proposed approach to correlate fracture initiation. The latter results in an apparent strength scaling of micromachined silicon structures that has obvious ramifications with regard to the design of reliable MEMS structures without exhaustive testing

Keywords

elemental semiconductors; fracture; micromachining; micromechanical devices; semiconductor epitaxial layers; silicon; tensile testing; Si; design; fabrication; fracture initiation; free-standing thin film test structures; mechanical behavior; microelectromechanical systems; micromachined silicon structures; micromachined single crystal silicon structures; micromechanical tensile testing; reliable MEMS structures; strength scaling; Etching; Fabrication; Mechanical factors; Microelectromechanical systems; Micromechanical devices; Resists; Silicon; Tensile stress; Testing; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on

Conference_Location

Chicago, IL

Print_ISBN

0-7803-3829-4

Type

conf

DOI

10.1109/SENSOR.1997.613725

Filename

613725