New robust small radius joints based on thermal shrinkage of polyimide in V-grooves

Author

Ebefors, Thorbjörn ; Kalvesten, E. ; Vieider, Christian ; Stemme, Göran

Author_Institution

Dept. of Signal Sensor & Syst., R. Inst. of Technol., Stockholm, Sweden

Volume

1

fYear

1997

fDate

16-19 Jun 1997

Firstpage

675

Abstract

A novel and simple technology for making robust three-dimensional (3-D) silicon structures with small radii of bending has been developed and investigated. The proposed method of bending 3-D structures out of plane so that they stay bent without special locking arrangements is based on thermal shrinkage of polyimide in V-grooves. The structures can be used in both static and dynamic mode for 3-D sensor or actuator applications

Keywords

bending; elemental semiconductors; etching; microactuators; micromachining; microsensors; polymer films; silicon; thermal expansion; wafer bonding; 3-D actuator; 3-D sensor; Si; V-grooves; anisotropic KOH etching; dynamic mode; polyimide; robust small radius joints; robust three-dimensional Si structures; small radii of bending; static mode; surface micromachining; thermal shrinkage; wafer bonding; Actuators; Fabrication; Fixtures; Microelectronics; Micromachining; Microstructure; Polyimides; Production; Robustness; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on

Conference_Location

Chicago, IL

Print_ISBN

0-7803-3829-4

Type

conf

DOI

10.1109/SENSOR.1997.613742

Filename

613742