Title :
New robust small radius joints based on thermal shrinkage of polyimide in V-grooves
Author :
Ebefors, Thorbjörn ; Kalvesten, E. ; Vieider, Christian ; Stemme, Göran
Author_Institution :
Dept. of Signal Sensor & Syst., R. Inst. of Technol., Stockholm, Sweden
Abstract :
A novel and simple technology for making robust three-dimensional (3-D) silicon structures with small radii of bending has been developed and investigated. The proposed method of bending 3-D structures out of plane so that they stay bent without special locking arrangements is based on thermal shrinkage of polyimide in V-grooves. The structures can be used in both static and dynamic mode for 3-D sensor or actuator applications
Keywords :
bending; elemental semiconductors; etching; microactuators; micromachining; microsensors; polymer films; silicon; thermal expansion; wafer bonding; 3-D actuator; 3-D sensor; Si; V-grooves; anisotropic KOH etching; dynamic mode; polyimide; robust small radius joints; robust three-dimensional Si structures; small radii of bending; static mode; surface micromachining; thermal shrinkage; wafer bonding; Actuators; Fabrication; Fixtures; Microelectronics; Micromachining; Microstructure; Polyimides; Production; Robustness; Silicon;
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
DOI :
10.1109/SENSOR.1997.613742
