• DocumentCode
    31431
  • Title

    Scheduling of Dual-Arm Cluster Tools With Wafer Revisiting and Residency Time Constraints

  • Author

    Yan Qiao ; NaiQi Wu ; Meng Chu Zhou

  • Author_Institution
    Dept. of Ind. Eng., Guangdong Univ. of Technol., Guangzhou, China
  • Volume
    10
  • Issue
    1
  • fYear
    2014
  • fDate
    Feb. 2014
  • Firstpage
    286
  • Lastpage
    300
  • Abstract
    In its fabrication, a wafer must meet its residency time constraints, i.e., it must leave its process chamber within a certain time after its process is done. It may need to visit some processing steps for a number of times, called wafer revisiting. For the typical wafer revisiting process of atomic layer deposition (ALD), this paper studies the scheduling problem of dual-arm cluster tools with both residency time constraints and wafer revisiting. To do so, a Petri net model is developed for the system. Then, with the Petri net model and based on a one-wafer cyclic scheduling method previously developed by the authors of this paper, schedulability conditions and scheduling algorithms are derived. The schedulability can be checked by analytical expressions. If schedulable, an optimal one-wafer cyclic schedule can be found by simple calculation. Thus, the proposed approach is very efficient. In addition, with the Petri net model, a simple way is presented to implement the obtained schedule. Illustrative examples are given to show the application of the proposed approach.
  • Keywords
    Petri nets; atomic layer deposition; cluster tools; semiconductor process modelling; Petri net model; atomic layer deposition; dual-arm cluster tools; one-wafer cyclic scheduling method; residency time constraints; wafer revisiting; Color; Firing; Load modeling; Robots; Schedules; Semiconductor device modeling; Time factors; Cluster tools; Petri net; scheduling; semiconductor manufacturing;
  • fLanguage
    English
  • Journal_Title
    Industrial Informatics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1551-3203
  • Type

    jour

  • DOI
    10.1109/TII.2013.2272702
  • Filename
    6556996