Title :
Quality Level and Fault Coverage for Multichip Modules
Author :
Torku, K.E. ; Radke, C.E.
Author_Institution :
IBM General Technology Division, East Fishkill, Hopewell Junction, NY
Abstract :
A relationship between the quality level of a multichip module package and test coverage is established. A fault model for each stage of assembly of the package is assumed and the contribution of each of these stages to the quality level is assessed to produce the required relationship to test coverage achieved through test generation programs.
Keywords :
Fault coverage; package test; product quality level; testing; yield; Assembly; Automatic testing; Fault detection; Logic testing; Multichip modules; Packaging; Semiconductor device modeling; Virtual manufacturing; Wafer scale integration; Wiring; Fault coverage; package test; product quality level; testing; yield;
Conference_Titel :
Design Automation, 1983. 20th Conference on
Print_ISBN :
0-8186-0026-8
DOI :
10.1109/DAC.1983.1585649
