• DocumentCode
    3146428
  • Title

    Quality Level and Fault Coverage for Multichip Modules

  • Author

    Torku, K.E. ; Radke, C.E.

  • Author_Institution
    IBM General Technology Division, East Fishkill, Hopewell Junction, NY
  • fYear
    1983
  • fDate
    27-29 June 1983
  • Firstpage
    201
  • Lastpage
    206
  • Abstract
    A relationship between the quality level of a multichip module package and test coverage is established. A fault model for each stage of assembly of the package is assumed and the contribution of each of these stages to the quality level is assessed to produce the required relationship to test coverage achieved through test generation programs.
  • Keywords
    Fault coverage; package test; product quality level; testing; yield; Assembly; Automatic testing; Fault detection; Logic testing; Multichip modules; Packaging; Semiconductor device modeling; Virtual manufacturing; Wafer scale integration; Wiring; Fault coverage; package test; product quality level; testing; yield;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation, 1983. 20th Conference on
  • ISSN
    0738-100X
  • Print_ISBN
    0-8186-0026-8
  • Type

    conf

  • DOI
    10.1109/DAC.1983.1585649
  • Filename
    1585649
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3146428