• DocumentCode
    3148989
  • Title

    Experimental study of ESD effect on metallic enclosure

  • Author

    Chan, K.H. ; Fung, L.C. ; Leung, S.W.

  • Author_Institution
    Dept. of Electron. Eng., City Univ. of Hong Kong, China
  • fYear
    2002
  • fDate
    21-24 May 2002
  • Firstpage
    490
  • Lastpage
    492
  • Abstract
    Electrostatic Discharge (ESD) can cause serious problems in digital electronic devices. Indirect coupling through apertures on the metallic enclosure to the internal circuitries can also affect the performance of the devices. In this paper, we investigate experimentally the effect of the coupling field through apertures on the metallic enclosure.
  • Keywords
    electromagnetic coupling; electromagnetic shielding; electrostatic discharge; aperture; digital electronic device; electromagnetic shielding; electrostatic discharge; indirect coupling field; internal circuit; metallic enclosure; Apertures; Cable shielding; Cooling; Coupling circuits; Electrostatic discharge; IEC standards; Iron; Oscilloscopes; Protection; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2002 3rd International Symposium on
  • Print_ISBN
    0-7803-7277-8
  • Type

    conf

  • DOI
    10.1109/ELMAGC.2002.1177477
  • Filename
    1177477
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3148989