DocumentCode :
3151067
Title :
Deterioration characteristics of insulation subjected to partial discharge in SF6 gas
Author :
Okabe, S. ; Kawashima, T. ; Wada, H. ; Teranishi, T. ; Hosokawa, O.
Author_Institution :
Power Eng. R&D Center Lighting & Insulation Group, Tokyo Electr. Power Co., Japan
Volume :
2
fYear :
2002
fDate :
6-10 Oct. 2002
Firstpage :
792
Abstract :
The gas insulated transformer using SF6 gas as the insulating medium has been developed and rapid increase in Japan recently. Different type insulating materials which are not used in a conventional oil-filled transformer are used in a gas-insulated transformer. The criteria of charge quantity at the partial discharge test currently performed with the transformer are based on the characteristics of conventional oil-filled transformer. The deterioration characteristics of the new material used in a gas-insulated transformers are not well known to be equivalent to those of a conventional insulation materials. In this paper, the insulation materials applied in a gas-insulated transformer were exposed to AC partial discharge, and deterioration characteristics which is estimated with a failing impulse breakdown voltage were investigated. As a result, harmful partial discharge level for gas-insulated transformers is expected to be about 10000 pC.
Keywords :
SF6 insulation; electric charge; gas insulated transformers; insulation testing; partial discharge measurement; power transformer insulation; power transformer testing; AC partial discharge; Japan; SF6; SF6 gas insulating medium; charge quantity; deterioration characteristics; gas insulated transformer; impulse breakdown voltage; partial discharge test; Conductive films; Engine cylinders; Gas insulation; Oil insulation; Partial discharges; Positron emission tomography; Power transformer insulation; Sheet materials; Sulfur hexafluoride; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Transmission and Distribution Conference and Exhibition 2002: Asia Pacific. IEEE/PES
Print_ISBN :
0-7803-7525-4
Type :
conf
DOI :
10.1109/TDC.2002.1177576
Filename :
1177576
Link To Document :
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