S-Parameter-Based Modal Decomposition of Multiconductor Transmission Lines and Its Application to De-Embedding

Author

Amakawa, S. ; Yamanaga, K. ; Ito, H. ; Sato, T. ; Ishihara, N. ; Masu, K.

Author_Institution

Tokyo Inst. of Technol., Tokyo

fYear

2009

fDate

March 30 2009-April 2 2009

Firstpage

177

Lastpage

180

Abstract

Theory and experiments are presented of modal decomposition of scattering matrices of multiconductor transmission lines (TLs). In effect, n coupled TLs are decomposed into n independent ones. Its use is demonstrated by applying it to thru-only de-embedding of 4 coupled TLs (synthesized data) and 2 coupled TLs (measurement data from a 0.18 mum-CMOS chip). The proposed de-embedding method could greatly facilitate accurate characterization of on-chip multiport networks.

Keywords

S-matrix theory; S-parameters; coupled transmission lines; modal analysis; multiconductor transmission lines; multiport networks; transmission line matrix methods; S-parameter-based modal decomposition; coupled TL; deembedding method; multiconductor transmission lines; on-chip multiport network; scattering matrices; Couplings; Data mining; Frequency conversion; Laboratories; Multiconductor transmission lines; Performance evaluation; Scattering; Symmetric matrices; Transmission line matrix methods; Transmission line measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Test Structures, 2009. ICMTS 2009. IEEE International Conference on

Conference_Location

Oxnard, CA

Print_ISBN

978-1-4244-4259-1

Type

conf

DOI

10.1109/ICMTS.2009.4814635

Filename

4814635