Title :
Dielectric properties of inorganic-organic silica-polyimide composite films prepared via sol-gel and thermal imidization processes
Author :
Kim, Youngkyoo ; Ree, Moonhor ; Chang, Taehyun ; Ha, Chang-Sik
Author_Institution :
Dept. of Polymer Sci. & Eng., Pusan Nat. Univ., South Korea
Abstract :
In this study, we prepared inorganic-organic silica-polyimide hybrid composite films from tetraethoxy silane (TEOS) and polyimide precursors via sol-gel process and thermal imidization. The dielectric properties of the silica-polyimide composite films were investigated. In particular, the dependence of the dielectric constant on the polyimide precursor types was discussed
Keywords :
VLSI; dielectric thin films; filled polymers; multichip modules; particle reinforced composites; permittivity; polymer films; polymerisation; silicon compounds; sol-gel processing; dielectric constant; dielectric properties; hybrid composite films; polyimide precursors; silica-polyimide composite films; sol-gel preparation; tetraethoxy silane; thermal imidization processes; Dielectric constant; Electrodes; Polyimides; Polymer films; Silicon compounds; Solvents; Thermal expansion; Thermal resistance; Very large scale integration; Voltage;
Conference_Titel :
Properties and Applications of Dielectric Materials, 1997., Proceedings of the 5th International Conference on
Conference_Location :
Seoul
Print_ISBN :
0-7803-2651-2
DOI :
10.1109/ICPADM.1997.616578
