DocumentCode
315447
Title
Flip Chip Market Trends And Infrastructure Limitations
Author
Vardaman, E. Jan ; Goodman, Thomas
fYear
1997
fDate
16-18 April 1997
Firstpage
37
Lastpage
40
Keywords
Bonding; Electronics packaging; Flip chip; Integrated circuit packaging; Integrated circuit technology; Laminates; Microprocessors; Production; Semiconductor device packaging; Semiconductor materials;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
618974
Link To Document