DocumentCode
315452
Title
The Application Of Flip Chip Bonding Technology To The Mobile Communications Terminals
Author
Takizawa, Minoru ; Toni, Akiko
fYear
1997
fDate
16-18 April 1997
Firstpage
62
Lastpage
66
Keywords
Bonding forces; Flip chip; Gold; Mobile communication; Plastic integrated circuit packaging; Reflow soldering; Semiconductor device measurement; Surface-mount technology; Temperature distribution; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
618979
Link To Document