Title :
A New Built-up Epoxy Resin Pcb Technology For High Density Surface Mount Package And Device Attachment
Author :
Harazono, Masaaki ; lwata, Y. ; Takami, Seiichi
Keywords :
Conducting materials; Copper; Epoxy resins; Insulation; Nonhomogeneous media; Packaging; Printed circuits; Space technology; Surface-mount technology; Thin film circuits;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6