DocumentCode :
315453
Title :
A New Built-up Epoxy Resin Pcb Technology For High Density Surface Mount Package And Device Attachment
Author :
Harazono, Masaaki ; lwata, Y. ; Takami, Seiichi
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
82
Lastpage :
85
Keywords :
Conducting materials; Copper; Epoxy resins; Insulation; Nonhomogeneous media; Packaging; Printed circuits; Space technology; Surface-mount technology; Thin film circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
618983
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=315453
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