Title :
Direct Nickel Plating on Aluminum Substrate for Microbumps Fabrication
Author :
Watanabe, Hideto ; Honma, Hideo
Keywords :
Aluminum; Bonding; Electrodes; Fabrication; Nickel; Oxidation; Palladium; Resists; Surface morphology; Temperature;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
