DocumentCode
315460
Title
A New Approach To Cu-cu Direct Bump Bonding
Author
Suga, Tadatomo ; Yuuki, Fumio ; Hosoda, Naoe
fYear
1997
fDate
16-18 April 1997
Firstpage
146
Lastpage
151
Keywords
Argon; Atomic beams; Electrical resistance measurement; Filling; Large scale integration; Packaging; Semiconductor device measurement; Substrates; Temperature; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
618995
Link To Document