DocumentCode
315461
Title
Bonding Resistance Of Sbb Technique
Author
Masahiro Go ; Tomura, Yoshihiro ; Bessho, Yoshihiro ; Shiraisbi, T. ; Eda, Kazuo ; Ishida, Tom
fYear
1997
fDate
16-18 April 1997
Firstpage
152
Lastpage
157
Keywords
Artificial intelligence; Bonding forces; Conductive adhesives; Electrodes; Gold; Large scale integration; Resins; Stress; Thermal force; Thermal stability;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
618996
Link To Document